People’s Choice Award
The award will be divided into two stages. The scores from both stages will be tallied on April 30th, and the team with the most votes will be announced on-site to receive the People’s Choice Award!
1. Social Media Likes/Votes Before the Finals
The organizer will count the likes on each team's post on April 28th (Tue).
2. Online voting on the day of the finals
Before the awards ceremony begins, an online voting QR code will be provided to all participants for immediate voting.
| Category | Team Name | Entry Title | Team ID | Social Media Posting | |
| Advanced Process Technology Development Category | UTokyo in ECDL | Ultrascaled Two-Dimensional Material Transistors for Angstrom-Era Logic Technologies | 2526_A_0010 | https://www.threads.com/@su19990205/post/DXEm7SzGGZO?xmt=AQF0QvD8M_olP6OfnO7kuLhsJvgR3qnGpa12S9coe1jgCPeqm-h-kB4lQ2eDqLIdZ2bufyw&slof=1 | |
| TMSB LAB | Development of Next-Generation High-Performance RRAM Process | 2526_A_0017 | https://www.facebook.com/share/p/1GkVRLdN2c/ | ||
| Round 2 | Defining Next-Gen Low-Power Ferroelectric Memory: 0.8 V Ultra-Low Operation Voltage for Selector-Free FeRAM and Neuromorphic Computing via Nb Electrode Engineering | 2526_A_0029 | https://www.threads.com/@cyuan81/post/DW3gCduk514?xmt=AQF0wpou4R_lqKx1EsKxFgpcFc1pyp-7B4AbI5ULDCyfkw | ||
| Refresh | Empowering Long-Life Ferroelectric Memory: Mitigation of Access-Rate-Dependent Degradation and Operation-Device Co-Optimization for Robust FeRAM | 2526_A_0030 | https://www.threads.com/@cyuan81/post/DW3gCduk514?xmt=AQF0wpou4R_lqKx1EsKxFgpcFc1pyp-7B4AbI5ULDCyfkw | ||
| Next-Generation Semiconductor Applied Materials Category | TxC Group | Heterogeneous Integration of Low-Dimensional Complex Oxides with Silicon Platform | 2526_B_0013 | https://www.instagram.com/p/DWgOx_AkQg9/?igsh=OTljM3NpczdydHps | |
| The IG-ZOne | Breaking the Memory Density Bottleneck: Multi-bit to 3D OS-FeFETs | 2526_B_0014 | https://www.linkedin.com/posts/rachitdobhal_micronmimory-micron-semiconductors-activity-7441741935700250624-jMok?utm_source=share&utm_medium=member_desktop&rcm=ACoAADBFq0cBc0myMg6MhVHliJyLnMBWXAPxgMc | ||
| Ag-Reli Lab | CeO₂-Modified Sintered Silver Die-Attach Material for High-Reliability Power Packaging | 2526_B_0018 | https://www.facebook.com/share/p/1CdnUh95JR/ | ||
| SM Lab | SrMnO₃ based self-rectifying behavior in memristor crossbar arrays | 2526_B_0040 | https://www.facebook.com/share/p/1NLbQ8faGD/?mibextid=wwXIfr | ||
| SK | Optimizing Formic-Acid-Induced Cu Nanocluster Morphology for High-Strength Cu–Cu Bonding in Advanced Packaging Materials | 2526_B_0050 | https://www.linkedin.com/posts/sarim-khan11_micronmimory-micron-mdyhkj-activity-7440752055952195584-qPsV?utm_source=social_share_send&utm_medium=member_desktop_web&rcm=ACoAADiwSQQBTNy_Ueok_a1kET3vFR9jPUdP_rY | ||
| Device Design and Development Category | tao_chou.tgz | Transistor-to-Package Thermal Simulation with Hotspot Mitigation by Decoupling | 2526_C_0001 | https://www.threads.com/@tao_chou.tgz/post/DWOOkjDEm2T?xmt=AQF00_MeKzhrQoYFKzVTbrPpT0X8zElbqGwO88WcsLjdT2DAmZKGpNqq2QdLUaGfWD73yhL3&slof=1 | |
| 擋我一根 | Advanced 2D inverter | 2526_C_0017 | https://www.instagram.com/p/DXEum1REx8D/?igsh=bzJ3bmdjYTFzNWFz | ||
| 三人四腳 | Concurrent design and noise-margin verification for energy-efficient SRAM with universal-assist circuits | 2526_C_0019 | https://www.threads.com/@tingyi_0819/post/DWkxDuaEpOl?xmt=AQF09bGg07kd3XHTZxzPAv1RbuX5eKX2lp_Ol5rBbpy69WrQHq4DUCET4lGuetPxCt_VRbih&slof=1 | ||
| Team Teh Tarik (拉茶隊) |
Beyond the Bucket Effect: A Multivariate Adaptive Refresh Controller for DRAM | 2526_C_0037 | https://www.linkedin.com/posts/chan-jia-ming-55853b260_micron-micronmimory-teamtehtarik-share-7449256402084311040-Zs5z?utm_source=share&utm_medium=member_desktop&rcm=ACoAAEAmvFQB0Iy5oabHge23SU4RcVCyUf_mNB4 | ||
| Next, then | Physics-Driven Compact SPICE Modeling of Integrated 1TnR-Latch cells for Neuromorphic Long-Short Term Memory Design | 2526_C_0071 | https://www.threads.com/@lianqiao2/post/DWOjuu8k8U4 | ||
| Semiconductor Production and Manufacturing Category | AI說得隊 | Generative AI–Based Semiconductor Intelligent Manufacturing Assistant | 2526_D_0011 | https://www.threads.com/@pinpin_20154/post/DWdooxCkafC?xmt=AQF0WIIVsw4fa9iUmYZtJCGujESivcmnImJQ-2Hf29Bcwt4X2wgGNemCpCw8vnC9QNcdPsxi&slof=1 | |
| AIM LAB | Intelligent platform of bonding/inspection/control systems for 3D packaging integration | 2526_D_0014 | https://www.facebook.com/share/p/18TYv1diB5/ | ||
| m'AIcron | Adaptive Semiconductor Patterning Inspection: A Knowledge-Driven Multi-Modal Framework for Dynamic Manufacturing Conditions | 2526_D_0029 | https://www.facebook.com/share/1HpEvYRKvj/?mibextid=wwXIfr | ||
| YehLab | Isaac Sim Digital Twin for HBM Stacking: Placement Recipe Optimization for Vacuum-Based Die Placement | 2526_D_0038 | https://www.instagram.com/p/DWxpdbLklDo/?igsh=MXVuZnM1N2s1dWI5dg== | ||
| UW wafer defect detection team | Multi-Class wafer defect detection model | 2526_D_0043 | https://www.linkedin.com/posts/jia-xian-jian-b605882a9_micron-mimoryawards-semiconductor-share-7449309586156584960-kSum?utm_source=social_share_send&utm_medium=ios_app&rcm=ACoAAEpNUHgBU2VdOSTEQBG8zLIPNOLuLzfhueE&utm_campaign |