Congratulations to the following 20 teams for advancing to the finals.
| Registration Category | Account/Team ID | Team name | Entry Title | ||
| 先進製程技術開發組 Advanced Process Technology Development Category |
2526_A_0005 | NonVolatileLich | Integration of 7nm HZO Metal-Ferroelectric-Metal Capacitors with β-W Electrode into Non-Volatile SRAM | ||
| 2526_A_0010 | UTokyo in ECDL | Ultrascaled Two-Dimensional Material Transistors for Angstrom-Era Logic Technologies | |||
| 2526_A_0017 | TMSB LAB | Development of Next-Generation High-Performance RRAM Process | |||
| 2526_A_0029 | Round 2 | Defining Next-Gen Low-Power Ferroelectric Memory: 0.8 V Ultra-Low Operation Voltage for Selector-Free FeRAM and Neuromorphic Computing via Nb Electrode Engineering | |||
| 2526_A_0030 | Refresh | Empowering Long-Life Ferroelectric Memory: Mitigation of Access-Rate-Dependent Degradation and Operation-Device Co-Optimization for Robust FeRAM | |||
| 新世代半導體應用材料組 Next-Generation Semiconductor Applied Materials Category |
2526_B_0013 | TxC Group | Heterogeneous Integration of Low-Dimensional Complex Oxides with Silicon Platform | ||
| 2526_B_0014 | The IG-ZOne | Breaking the Memory Density Bottleneck: Multi-bit to 3D OS-FeFETs | |||
| 2526_B_0018 | Ag-Reli Lab | CeO₂-Modified Sintered Silver Die-Attach Material for High-Reliability Power Packaging | |||
| 2526_B_0040 | SM Lab | SrMnO₃ based self-rectifying behavior in memristor crossbar arrays | |||
| 2526_B_0050 | SK | Optimizing Formic-Acid-Induced Cu Nanocluster Morphology for High-Strength Cu–Cu Bonding in Advanced Packaging Materials | |||
| 元件設計開發組 Device Design and Development Category |
2526_C_0001 | tao_chou.tgz | Transistor-to-Package Thermal Simulation with Hotspot Mitigation by Decoupling | ||
| 2526_C_0017 | 擋我一根 | Advanced 2D inverter | |||
| 2526_C_0019 | 三人四腳 | Concurrent design and noise-margin verification for energy-efficient SRAM with universal-assist circuits | |||
| 2526_C_0037 | Team Teh Tarik (拉茶隊） | Beyond the Bucket Effect: A Multivariate Adaptive Refresh Controller for DRAM | |||
| 2526_C_0071 | Next, then | Physics-Driven Compact SPICE Modeling of Integrated 1TnR-Latch cells for Neuromorphic Long-Short Term Memory Design | |||
| 半導體生產製造組 Semiconductor Production and Manufacturing Category |
2526_D_0011 | AI說得隊 | Generative AI–Based Semiconductor Intelligent Manufacturing Assistant | ||
| 2526_D_0014 | AIM LAB | Intelligent platform of bonding/inspection/control systems for 3D packa ging integration | |||
| 2526_D_0029 | m'AIcron | Adaptive Semiconductor Patterning Inspection: A Knowledge-Driven Multi-Modal Framework for Dynamic Manufacturing Conditions | |||
| 2526_D_0038 | YehLab | Isaac Sim Digital Twin for HBM Stacking: Placement Recipe Optimization for Vacuum-Based Die Placement | |||
| 2526_D_0043 | UW wafer defect detection team | Multi-Class wafer defect detection model | |||